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#1 03-01-2019 10:57:42

Date d'inscription: 23-10-2018
Messages: 94

The identification method of the grinding wheel piece knows

When buying a grinding wheel, consumers should make a good job of identifying them, and good quality can bring good work efficiency. Pay attention to the appearance and details. It is the most common method for users to select the fiber cutting disc Chinese supplier. It is necessary but not the only way to observe the color, properties, cracks and deformation of the grinding wheel. In terms of knowledge, the following is a detailed explanation of these points.
First point: Before using the grinding wheel, carefully identify the marking of the grinding wheel.
Second point: When identifying, be sure to note that the safe speed of the grinding wheel cannot be higher than the maximum working circumferential speed.
The third point: Before installation, it is necessary to carry out detailed inspection, carefully check whether the product model is correct, whether there is any crack on the surface of the tool.
Learn the above identification methods for everyone, when buying a grinding wheel, you don't have to worry about which one to choose. The correct selection method can buy a truly valuable grinding wheel, and a comprehensive understanding of the grinding wheel can truly select a good quality product.
Professionals know that after a period of use, the cutting surface will have a certain degree of wear and deformation on the working surface. Moreover, because the precision of the feeding of the microtome is limited, the thickness of the silicon wafer is dispersed and the dispersion is large. At this time, in order to work better for the cutting piece, it is imperative to grind the cutting piece. So how should grinding sanding be done? Decrypt the correct way to grind the pieces for you!
Grinding the silicon wafer is actually to frictionally rub the silicon surface with the abrasive under a certain pressure, and remove the damaged layer on the surface of the silicon wafer by mechanical grinding. The polished silicon wafer is smoother and smoother than the cutting, and reaches a predetermined thickness. Choosing the right form of motion and using the right abrasive can improve the quality of the disc.
Of course, suitable abrasives are also very critical. If the hot sale cutting wheel that has been used for a long time is not polished, it will not work properly, which will affect the efficiency of the enterprise and increase the product cost. Grinding and grinding is an indispensable part of long-term work. The way to grind the grinds can help you adjust and trim, work better and create value.

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#2 10-02-2019 21:10:40

Helen Styles

Re: The identification method of the grinding wheel piece knows

The quality of the products depends on the kind of machine that is being used. - Doug Battista

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